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DQFX-16506 8.5 kW Semiconductor Grinding Spindle

A 165 mm spindle body supports a 200 mm grinding wheel at speeds up to 6,000 rpm. The DQFX-16506 supplies 8.5 kW continuously, 13.5 Nm torque and vibration velocity of no more than 0.15 mm/s.
Diameter Φ165mm
Maximum speed 6000rpm
Torque(S1) 13.5Nm
Torque(S6-40%) 20.3Nm
Power(S1) 8.5kW
Power(S6-20%) 12.75kW
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DQFX-16506 8.5 kW Semiconductor Grinding Spindle

INTRODUCTION

FEATURES

APPLICATION

FAQ

TECHNICAL DATA

Grinding Spindle Specifications
DiameterΦ165mm
The highest speed6,000rpm
Grinding wheel dimensions200mm / 8inch
Bearing typeAir bearing
Max. Frequency400Hz
Motor systemSynchronous
The rated voltage220V
Power output S1 100%8.5kW
Power output S6 40%12.75kW
Output torque S1 100%13.5N.m
Output torque S6 40%20.3N.m
Rated current S1 100%27A
Rated current S6 40%40.5A
Gas flow76-84L/min (Air pressure 0.6MPa)
Cooling systemWater cooling
The cooling flow rate≥2.5L/min
Motor temperature sensor typeKTY84-130
Tool changeManual
Vibration velocity≤0.15mm/s
Weight79.5kg

DIMENSIONS

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Share your machine type, machining process, performance targets or existing component specifications with Haozhi. Our technical team can support spindle selection, application matching, custom development and motion-component integration for new equipment and upgrade projects.
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