From silicon ingots to wafers, and ultimately to chips carrying tens of billions of transistors, semiconductor manufacturing involves hundreds of precision processes. Among them, wafer back grinding and wafer dicing are two core processes in semiconductor back-end manufacturing, featuring extremely high technical barriers and long dominated by overseas brands.
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Today, these critical technological barriers are being steadily overcome by local precision manufacturing leaders represented by Haozhi Industrial.
01 | Wafer Back Grinding: Pushing Precision to the Limit
Wafer back grinding is a critical process used to reduce wafer thickness for advanced packaging applications. However, ultra-thin wafers are highly susceptible to cracking, warpage, and grinding damage during machining. The larger the wafer and the thinner the target thickness, the greater the manufacturing challenge.
Haozhi Ultra-Precision Wafer Grinding Motorized Spindle
Nanometer-Level Precision Control: Spindle vibration across the full speed range is ≤0.1 mm/s, with rotational error as low as 20 nm. This enables 12-inch wafers to achieve TTV<3μm and="" surface="" roughness="" ra="">
High-Performance Motor Design: Equipped with a high-performance AC permanent magnet synchronous motor delivering continuous rated torque up to 18 N·m, providing stable cutting capability for ultra-hard materials such as silicon carbide.
Advanced Cooling Technology: Featuring a three-stage cooling structure with thermal stabilization time ≤20 minutes and thermal elongation fluctuation ≤100 nm, significantly minimizing thermal machining errors.
02 | Wafer Dicing: The Ultimate Challenge of Chip Separation
Wafer dicing precisely separates processed wafers into thousands of individual chips. Dicing lane width, edge quality, and machining stability directly impact chip yield and production efficiency.
Haozhi Air Bearing Dicing Spindle
High Rigidity: Innovative structural design improves rigidity and load capacity by 14.3% compared with similar market products, supporting demanding machining applications across silicon wafers, ceramics, quartz glass, and package substrates.
High Precision: Taper runout is ≤0.5μm, while radial and axial runout are both ≤1μm. Spindle elongation fluctuation during continuous machining remains ≤0.3μm.
High Reliability: Enhanced waterproof and dustproof protection with IP67-rated motor design. Continuous operating life reaches up to 6,525 hours.
03 | From "Alternative" to "Preferred Choice"
Replacing semiconductor core components has traditionally been regarded as a high-risk decision. Haozhi Industrial's transition from an "alternative option" to a "preferred choice" is built on long-term technological accumulation and proven market performance.
Performance & Industry Growth
Revenue reached RMB 1.595 billion in 2025, up 22.04% year-over-year.
Q1 2026 revenue reached RMB 496 million, representing year-over-year growth of 72.88%.
Spindle business revenue in Q1 2026 reached RMB 329 million, growing 91.60% year-over-year.
Haozhi ranked No.1 globally in motorized spindle market share for three consecutive years.
R&D investment consistently accounts for more than 8% of total revenue, supported by over 380 engineers and 852 authorized patents.
Two Decades of Precision Manufacturing Expertise
Since 2006, Haozhi Industrial has focused on the R&D, manufacturing, sales, and maintenance services of core functional components for high-end CNC machine tools, robotics, and new energy vehicles.
The company has achieved major breakthroughs in ultra-precision air bearing high-speed motorized spindle technologies and was awarded the First Prize of the 2022 Science and Technology Progress Award for its project focused on high-speed precision motorized spindles for high-end CNC machine tools.
For semiconductor customers, equipment selection is not simply about choosing a spindle — it is about choosing a reliable long-term partner capable of continuous innovation and stable technical support.
04 | China's Precision Manufacturing Strength Behind Every Micron
From micron-level precision to nanometer-level breakthroughs, Haozhi Industrial's advancements in semiconductor spindle solutions demonstrate the rapid transformation of China's precision manufacturing industry.
This evolution goes far beyond simple domestic substitution. It reflects the emergence of globally competitive solutions in precision, stability, reliability, and manufacturing efficiency — delivering long-term value to semiconductor customers worldwide.
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